Summary
Machine-generated summaryFraunhofer-Gesellschaft, Einkauf B12, awarded a contract for one CMP system for chemical mechanical polishing of dielectric layers such as silicon oxide on 100 mm and 150 mm Si and III-V semiconductor wafers, with integrated cleaning and optical endpoint detection. The polishing aims to planarize surfaces and improve surface roughness to enable subsequent wafer fusion bonding of III-V semiconductors with Si wafers. The contract was awarded to Accretech. Options cover separate drainage lines for DI water and chemicals, a SECS/GEM interface, and torque EPD.
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Source: TED - Tenders Electronic Daily (Publications Office of the EU)
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Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 4 weeks ago
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