Description
For the dicing of silicon wafers, dicing blades, compatible with the DISCO wafer dice DFD6340 are to be purchased
Sägeblätter / dicing blates
Timing
15 days from publication to deadline.
- Published
- Deadline
- Awarded pending
Official source
Always verify details on the official notice.
Last verified against Datenservice Öffentlicher Einkauf (Bekanntmachungsservice) - nationale Bekanntmachungen VOL und ohne Rechtsrahmen 2 weeks ago
The buyer
Full buyer profileFraunhofer ENAS
More figures
The buyer in figures
Fraunhofer ENAS
- notices in the register
- 18
Who wins its contracts
- of its calls state an estimated value
- 0%
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