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Germany - Laboratory, optical and precision equipments (excl. glasses) - Flip Chip Die Bonder

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  1. Published
  2. Deadline open for 30 days
  3. Awarded pending

Summary

Machine-generated summary

A German buyer is procuring a flip chip die bonder for laboratory, optical and precision equipment. The machine places semiconductor chips flipped onto sensors with micrometer precision, directly connecting the chip underside via contact bumps. It must support soldering, thermal bonding and conductive adhesive bonding, and include modules for precision die bonding, chip and substrate heating with process gas enclosure, software-controlled bonding force, ultrasonic bonding, in-situ video monitoring, alignment reference generation, tool tip changing with three tool tips, dispenser, UV-curing and die-eject functions. The buyer, estimated value, deadline and procedure details are not stated in the available description. Interested suppliers should consult the official tender documents for requirements and submission terms.

Description

In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding. The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module

Official source

Source: TED - Tenders Electronic Daily (Publications Office of the EU)

Always verify details on the official notice.

Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 3 weeks ago

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Market context

Avg. open tender · Laboratory & precision equipment
€5,603,992
2,330 open across Europe right now
Buyer track record on Aperlena
55 notices tracked · 26 awarded
€25,664,531 in awarded contracts

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