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Germany - Electronic measuring instruments - 200 mm Wafer Prober incl. Temperature Testing (IIS-05.1) - PR1227015-2440-P

Original Deutschland - Elektronische Messgeräte - 200 mm Wafer Prober incl. Temperature Testing (IIS-05.1) - PR1227015-2440-P

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  1. Published
  2. Deadline open for 33 days
  3. Awarded pending

Summary

Machine-generated summary

Fraunhofer IIS in Germany is procuring one 200 mm wafer probing system for characterization and test engineering of sensor ICs and chiplets. The system must handle 200 mm and 300 mm wafers and 300 mm dicing frames, with focus on probing accuracy and stimulation of optical and magnetic sensors, including a darkened DuT chamber and a non-magnetic wafer chuck. Optional items include dry air control, high voltage preparation, OCR reading, wafer ID capture, and remote control interfaces such as GPIB. Bidders should consult the tender documents for procedure details.

Description

1 Stück 200 mm Wafer Prober incl. Temperature Testing (IIS-05.1) This specification describes the requirements for one wafer probing system to be used for characterization and test engineering for sensor ICs and chiplets at the Fraunhofer IIS. The system must allow handling of 200 mm and 300 mm wafers and 300 mm dicing frames. The focus in the usage of the machine does not depend on short handling time and high throughput, but on accuracy in probing and possibility for stimulation of optical and magnetical sensors. For stimulation of optical sensors a darkened DuT chamber is mandatory. The Wafer Chuck has to be made off non-magnetic metarials to prevent distortion while characterizing magnetic field sensors. Option: 4.2 Wafer-Spannfutter ATT-Trockenluftregelung 4.9 Wafer-Spannfutter Hochspannungsvorbereitung 5.5 Beladung OCR-Lesegerät (Oberseite) 5.6 Beladung Wafer-ID-Erfassung für Text mit Standard- und Nicht-Standard-Schriftarten, Barcode und QR-Code 9.1 Elektrische Schnittstelle und Fernsteuerung Möglichkeit zur Fernsteuerung des Prober-Systems 9.2 Elektrische Schnittstelle und Fernsteuerung GPIB-Schnittstelle (IEEE-488)

Official source

Source: TED - Tenders Electronic Daily (Publications Office of the EU)

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Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 1 month ago

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