Summary
Machine-generated summaryThe National Centre for Advanced Semiconductor Packaging (NCASP) in the UK is procuring solder jetting equipment for processing photonic and semiconductor devices. The buyer requires the supply, delivery and installation of this machinery to develop an open-access scale-up facility. This aims to reduce reliance on overseas facilities, shorten lead times and protect intellectual property. The estimated value and submission deadline are not specified in the provided notice. Details regarding the exact procurement procedure and eligible bidders are also not stated. Small businesses capable of supplying and installing this specialized equipment are encouraged to review the full tender documents for complete technical requirements and application instructions.
Description
Official source
Source: Find a Tender Service (UK Cabinet Office / Crown Commercial Service)
Always verify details on the official notice.
Last verified against Find a Tender Service (UK Cabinet Office / Crown Commercial Service) 1 month ago
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Market context
- Buyer track record on Aperlena
- 123 notices tracked · 80 awarded
- €18,071,936 in awarded contracts
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