Summary
Machine-generated summaryUniversity of Strathclyde sought an advanced backgrind tape laminator and de-taping turnkey platform for the National Centre for Advanced Semiconductor Packaging (NCASP). The equipment must laminate and de-tape 6 inch, 8 inch and 12 inch thin wafers used in photonics. The purchase supports a UK open-access semiconductor packaging facility that will connect device design to domestic packaging, test and metrology. Community benefits were included in the requirement and the ITT was conducted via PCS-Tender under project code 32461. Bidding closed on 2026-08-17.
Description
Official source
Source: Public Contracts Scotland
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Last verified against Public Contracts Scotland 6 days ago
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- Avg. open tender · Laboratory & precision equipment
- €5,506,547
- Buyer track record on Aperlena
- 124 notices tracked · 81 awarded
- €18,071,936 in awarded contracts
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