Finland - Laboratory, optical and precision equipments (excl. glasses) - Edge-Handling Sputtering Cluster Tool

The buyer, VTT Micronova, is procuring an edge-handling sputtering cluster tool for its semiconductor front end cleanroom in Finland. The equipment is designed for 200-mm wafers and includes a deposition chamber with four magnetron sputtering sources. A key feature is that wafers are mechanically touched only at the edge during transport and processing, and they can be flipped in a vacuum between processes. The technical requirements are detailed in the invitation to tender documents. The estimated value, submission deadline, eligible bidders, and procedure type are not specified in the provided text.

Description

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Market context

Avg. open tender · Laboratory & precision equipment

€5,654,778

2,297 open across Europe right now

Buyer track record on Aperlena

24 notices tracked · 8 awarded

€4,640,034 in awarded contracts