Denmark - Laboratory equipment, optical equipment and precision equipment (not spectacles) - Blade Dicing Saw

DTU Nanolab, part of the Technical University of Denmark (DTU), has awarded a contract for a semi-automatic wafer dicing system for research and cleanroom operations. The system must process wafers up to 300 mm diameter and support conventional wafer dicing, circular wafer cutting, multi-circular cutting and edge trimming of circularly cut wafers to improve mechanical strength and handling robustness. It must also handle hard and thick materials used in advanced microfabrication and semiconductor research, including silicon carbide (SiC) and piezoelectric substrates. The equipment will be installed in DTU Nanolab's multi-user cleanroom environment and support research, innovation and industrial collaboration activities.

Description

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Market context

Avg. open tender · Laboratory & precision equipment

€5,443,417

2,058 open across Europe right now

Buyer track record on Aperlena

108 notices tracked · 67 awarded

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