Summary
Machine-generated summaryVTT Technical Research Centre of Finland Ltd procured a semi-automatic wafer metrology tool for measuring total thickness, total thickness variation, warp, bow, metallization bumps, trench or via depth and geometric factors in substrates such as silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides and thin deposited materials. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The contract was awarded to FRT GmbH for EUR 464,674.
Description
Official source
Source: TED - Tenders Electronic Daily (Publications Office of the EU)
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Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 2 weeks ago
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11
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€180,000
est. value
Market context
- Avg. open tender · Laboratory & precision equipment
- €5,443,417
- Buyer track record on Aperlena
- 25 notices tracked · 8 awarded
- €4,640,034 in awarded contracts
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