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Germany - Various machines and equipment for special purposes - System for High Aspect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

Original Deutschland - Diverse Maschinen und Geräte für besondere Zwecke - System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

Open Contract notice

Key facts

Where
Germany Dresden
Procedure
Negotiated procedure The buyer selects candidates, then negotiates the offers before choosing. Full entry Above the EU threshold A contract large enough that EU-wide rules apply and it must be published on TED. Full entry
CPV code The EU's common vocabulary for what is being bought: an eight-digit code every notice carries. Full entry
42990000 Miscellaneous special-purpose machinery
Original language
German
Published
Source
via TED - Tenders Electronic Daily (Publications Office of the EU), verified 1 month ago
Notice number
498425-2026
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The Aperlena Verdict

Open race

No supplier dominates: 26 different companies have won the last 35 comparable contracts from this buyer over 5 years. This is a genuinely open race.

Based on 35 comparable awards by this buyer in this sector over 5 years. Every verdict is recorded before the outcome and graded against the award notice. How we score ourselves.

Summary

Machine-generated summary

A German public buyer is procuring one high aspect ratio etch system consisting of a mainframe and process chambers (reference IPMS-CNT05.1). The fully automated process tool will be used for plasma etching on 300 mm wafers, specifically silicon CMOS wafers, in a cleanroom class 1000 production environment (approximately class 6 under EN ISO 14644-1). Its purpose is structuring of high aspect ratio features in silicon and associated materials such as SiO2 and SiN. Optional items are listed in the technical tender specification. Bidders should consult the original German tender documents for full requirements.

Description

1 Stück System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) Die Spezifikation beschreibt die Anforderungen an ein vollautomatisches Prozessgerät, das für Plasmaätzprozesse auf Wafern mit einem Durchmesser von 300 mm eingesetzt werden soll. Die Systeme werden für die Bearbeitung von Silizium-CMOS-Wafern in einer Produktionsumgebung der Reinraumklasse 1000 (entspricht in etwa Klasse 6 nach EN ISO 14644-1) eingesetzt. Das neue Werkzeug soll zur Strukturierung von Strukturen mit hohem Aspektverhältnis in Silizium sowie in allen damit verbundenen erforderlichen Materialien (z. B. SiO₂, SiN) eingesetzt werden, um dieses Hauptziel zu erreichen. Optionale Positionen gemäß Technical Tender Specification.

Official source

Source: TED - Tenders Electronic Daily (Publications Office of the EU)

Always verify details on the official notice.

Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 1 month ago

More from this buyer

Full buyer profile

87 open tenders right now

Who usually wins this buyer's contracts in this sector

Company Wins Total awarded Last win
EV Group E. Thallner GmbH 4 n/a Aug 2026
Applied Materials South East Asia Pte. Ltd. 3 n/a Apr 2026
KLA Corporation 3 n/a Aug 2026
AP und S International GmbH 2 n/a Sep 2026
SENTECH Gesellschaft für Sensortechnik mbH 2 n/a May 2026

Based on 35 awards with a linked company profile over the last 5 years.

Change history

Every time an official source republished this notice with different content. We watch every source we index, including regional copies of the same notice.

  1. Read before bidding
    • Scope and criteria: The description was expanded. Re-read it before you bid.

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Market context

Avg. open tender · Industrial machinery
€1,932,149
2,349 open across Europe right now
Buyer track record on Aperlena
385 notices tracked · 181 awarded
€651,275 in awarded contracts

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