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Germany - Various machines and devices for special purposes - Defect Inspection Tool (IPMS-MRS04.1) - PR948311-2480-P

Original Deutschland - Diverse Maschinen und Geräte für besondere Zwecke - Defect Inspection Tool (IPMS-MRS04.1) - PR948311-2480-P

Open Contract notice

Key facts

Buyer
Fraunhofer-Gesellschaft - Einkauf B12
Where
Germany Dresden
Procedure
Negotiated procedure The buyer selects candidates, then negotiates the offers before choosing. Full entry Above the EU threshold A contract large enough that EU-wide rules apply and it must be published on TED. Full entry
CPV code The EU's common vocabulary for what is being bought: an eight-digit code every notice carries. Full entry
42990000 Miscellaneous special-purpose machinery
Original language
German
Published
Source
via TED - Tenders Electronic Daily (Publications Office of the EU), verified 1 month ago
Notice number
14027-2026
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The Aperlena Verdict

Open race

No supplier dominates: 26 different companies have won the last 35 comparable contracts from this buyer over 5 years. This is a genuinely open race.

Based on 35 comparable awards by this buyer in this sector over 5 years. Every verdict is recorded before the outcome and graded against the award notice. How we score ourselves.

Summary

Machine-generated summary

The buyer is procuring one Defect Inspection Tool (IPMS-MRS04.1), a defect inspection system for detecting, identifying and classifying particles and pattern defects on structured and unstructured wafers. The device must handle substrates with variable thickness from about 390 to 1200 micrometres, offer sensitivity down to 200 nanometres, and be optimised for 200 mm MEMS wafers in a CMOS-compatible cleanroom environment. Optional items cover 300 mm wafer capability, separate BF/DF illumination, two-channel inspection, recipe creation without wafers, full wafer imaging, contamination limits, and handling of highly warped wafers. The place of performance is Germany.

Description

1 Stück Defect Inspection Tool (IPMS-MRS04.1) Diese Spezifikation beschreibt die Anforderungen an ein Fehlerinspektionssystem, das für die Erkennung, Identifizierung und Klassifizierung von Partikeln und Musterfehlern auf strukturierten und unstrukturierten Wafern entwickelt wurde. Das Gerät kann Substrate mit einer variablen Dicke von etwa 390 µm bis 1200 µm aufnehmen und bietet somit Flexibilität für verschiedene Wafertypen und Anwendungen. Das Inspektionssystem verfügt über eine Empfindlichkeit von bis zu 200 nm und ermöglicht so die Erkennung selbst kleinster Defekte, die die Leistung des Wafers beeinträchtigen könnten. Das System ist für den Halbleiterfertigungsprozess optimiert und speziell auf 200-mm-MEMS-Wafer in einer CMOS-kompatiblen Reinraumumgebung ausgerichtet. Optionale Positionen: 1.7 Allgemeine Anforderungen Fähigkeit zur Verarbeitung von 300-mm-Wafern ja/nein 3.2 Prozessspezifikation Fähigkeit zur separaten BF/DF-Beleuchtung ja/nein 3.3 Prozessspezifikation Fähigkeit zur Zweikanalinspektion (BF/DF) ja/nein 3.7 Prozessspezifikation Das Werkzeug unterstützt die Erstellung von waferlosen Rezepten ja/nein 3.29 Prozessspezifikation Fähigkeit zur Erzeugung eines vollständigen Waferbildes ja/nein 4.2 Kontaminationsgrad Kontaminationsgrad für Nichtedelmetalle Al, Ti ≤ 50,0*E10 at/cm², alle anderen Metalle ≤ 5,0*E10 at/cm²; ja/nein 4.4 Kontaminationsgrad Kontaminationsgrad für Edelmetalle (Ag, Au, Pd, Pt, Ru) Bestätigung der Edelmetallkonzentration < 0,05*E10 at/cm2 (< LOD); ja/nein 5.5 Kassetten-/Wafer-Spezifikationen Option zur Handhabung von Wafern mit hoher Wölbung < ± 200 µm ja/nein

Official source

Source: TED - Tenders Electronic Daily (Publications Office of the EU)

Always verify details on the official notice.

Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 1 month ago

View the official notice

More from this buyer

Full buyer profile

87 open tenders right now

Who usually wins this buyer's contracts in this sector

Company Wins Total awarded Last win
EV Group E. Thallner GmbH 4 n/a Aug 2026
Applied Materials South East Asia Pte. Ltd. 3 n/a Apr 2026
KLA Corporation 3 n/a Aug 2026
AP und S International GmbH 2 n/a Sep 2026
SENTECH Gesellschaft für Sensortechnik mbH 2 n/a May 2026

Based on 35 awards with a linked company profile over the last 5 years.

Change history

Every time an official source republished this notice with different content. We watch every source we index, including regional copies of the same notice.

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    • Scope and criteria: The description was expanded. Re-read it before you bid.

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Market context

Avg. open tender · Industrial machinery
€1,932,149
2,349 open across Europe right now
Buyer track record on Aperlena
385 notices tracked · 181 awarded
€651,275 in awarded contracts

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