Description
Background
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore.
Description
A Leak Testing capability is required for hermetic packages used in photonic and advanced semiconductor packaging.
The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 32473. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
Community benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
A summary of the expected community benefits has been provided as follows:
Please see Procurement documents for full details
(SC Ref:818603)
The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 32473. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
(SC Ref:839068)
Official source
Source: Public Contracts Scotland
Always verify details on the official notice.
Last verified against Public Contracts Scotland 17 hours ago
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Market context
- Avg. open tender · Laboratory & precision equipment
- €5,652,679
- Buyer track record on Aperlena
- 123 notices tracked · 81 awarded
- €18,249,211 in awarded contracts
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