Description
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module
Official source
Source: TED - Tenders Electronic Daily (Publications Office of the EU)
Always verify details on the official notice.
Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 7 hours ago
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- Avg. open tender · Laboratory & precision equipment
- €5,515,041
- Buyer track record on Aperlena
- 59 notices tracked · 28 awarded
- €25,899,288 in awarded contracts
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