Summary
Machine-generated summaryVTT in Finland is seeking to acquire an automated defect inspection system for 200 mm and 300 mm patterned wafers. The equipment must rapidly track defects during the manufacturing process of functional devices, including both in-line and end-of-line front-end stages. It needs to detect particles, voids, cracks, scratches, pits, bumps, and hazes within patterns made of silicon oxides, nitrides, polysilicon, metals, and photoresist. The buyer is VTT, located in Finland. The estimated value and the deadline are not specified in the provided text. Further details regarding technical requirements and the exact procedure are available in the invitation to tender documents. Eligible bidders must meet the specified requirements.
Description
Official source
Source: TED - Tenders Electronic Daily (Publications Office of the EU)
Always verify details on the official notice.
Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 1 month ago
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Market context
- Avg. open tender · Laboratory & precision equipment
- €5,662,366
- Buyer track record on Aperlena
- 24 notices tracked · 8 awarded
- €4,640,034 in awarded contracts
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