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Germany - Microelectronic machines and apparatus - 300 mm D2W hybrid bonding tool (IZM-131.1) - PR1254078-3460-P

Original Deutschland - Mikroelektronische Maschinen und Geräte - 300 mm D2W hybrid bonding tool (IZM-131.1) - PR1254078-3460-P

Open Contract notice

Key facts

Buyer
Fraunhofer-Gesellschaft - Einkauf B12
Where
Germany Dresden
Procedure
Negotiated procedure The buyer selects candidates, then negotiates the offers before choosing. Full entry Above the EU threshold A contract large enough that EU-wide rules apply and it must be published on TED. Full entry
CPV code The EU's common vocabulary for what is being bought: an eight-digit code every notice carries. Full entry
31712100 Microelectronic machinery and apparatus
Original language
German
Published
Source
via TED - Tenders Electronic Daily (Publications Office of the EU), verified 1 month ago
Notice number
534141-2026
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Summary

Machine-generated summary

The buyer, based in Germany, intends to purchase one 300 mm die-to-wafer (D2W) hybrid bonding tool for automated bonding used in heterogeneous 2.5D and 3D integration and chiplet assembly. The system must align and bond with an accuracy of +/- 200 nm on 300 mm wafers. Required functions include automatic loading and unloading of wafers from a 12-inch tape frame cassette and FOUP, reading wafer and tape frame IDs, feeding wafers and tape frames to the bonding unit, and picking dies from tape frames, with optional flipping, for precise placement. Programming and operation must suit research and development use.

Description

1x 300 mm D2W hybrid bonding tool (IZM-131.1) Der Zweck dieser Gerätespezifikation besteht darin, die Anforderungen für das automatisierte D2W-Bonding zur heterogenen 2,5D-/3D-QMI- und Chiplet-Integration zu definieren, das eine Verbindung mit einer Genauigkeit von +/- 200 nm auf einem 300-mm-Wafer ermöglicht. Diese Anlage ist in der Lage, folgende Prozessschritte auszuführen: 1) Automatisches Be- und Entladen der gewünschten Wafer aus einer 12-Zoll-Tape-Frame-Kassette und von 12-Zoll-Wafern aus einem Wafer-FOUP; 2) Auslesen der Wafer- und Tape-Frame-ID; 3) Automatisches Zuführen von Wafern auf den Spannfutter und von Tape-Frames in die Bond-Einheit; 4) Aufnehmen von Dies (Bauteilen) aus dem Tape-Frame, optionales Wenden und präzises Bonden auf den Wafer oder das Die. Die Programmierung und Bedienung muss innerhalb eines angemessenen Bereichs von Optionen und Parametern möglich sein, wie es für Forschung und Entwicklung erforderlich ist. Detaillierte Spezifikationen der einzelnen Module finden Sie weiter unten.

Official source

Source: TED - Tenders Electronic Daily (Publications Office of the EU)

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Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 1 month ago

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More from this buyer

Full buyer profile

87 open tenders right now

This buyer has no award history in this sector yet. Usual winners, Electrical machinery - Germany

Company Wins Total awarded Last win
Siemens Energy Global GmbH & Co. KG 8 €5.8M Jun 2026
Polyma Energiesysteme GmbH 8 €2.2M Aug 2026
Siemens AG 5 n/a Jun 2026
Starkstrom-Gerätebau GmbH 4 €85,300 Jun 2026
TKMS ATLAS ELEKTRONIK GmbH 4 n/a Aug 2026

Based on 350 awards with a linked company profile over the last 2 years.

Change history

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    • Scope and criteria: The description was expanded. Re-read it before you bid.

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Market context

Avg. open tender · Electrical machinery
€55,203,464
3,004 open across Europe right now
Buyer track record on Aperlena
385 notices tracked · 181 awarded
€651,275 in awarded contracts

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