Description
The object of the tender was a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment had to be new. The tool had to comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process was described in more detail in the invitation to tender documents.
Source officielle
Source : TED - Tenders Electronic Daily (Publications Office of the EU)
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Dernière vérification auprès de TED - Tenders Electronic Daily (Publications Office of the EU) il y a 1 mois
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5
jours restants
560 000 €
valeur est.
Contexte de marché
- Appel ouvert moyen · Machines industrielles
- 1 756 248 €
- Historique de l'acheteur sur Aperlena
- 24 avis suivis · 8 attribués
- 4 640 034 € de contrats attribués
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