Summary
Machine-generated summaryThe University of Strathclyde is seeking an automated laser chip tester capable of performing burn-in testing. The equipment will support the National Centre for Advanced Semiconductor Packaging (NCASP), an industry-led scale-up facility that connects UK device design to domestic packaging, test and metrology, reducing reliance on overseas assembly and test providers. The buyer is the University of Strathclyde in the United Kingdom. No estimated contract value, submission deadline or further details of the bidding procedure are provided in the notice. Interested suppliers should consult the full notice for information on how to participate and any applicable deadlines.
Description
Official source
Source: Find a Tender Service (UK Cabinet Office / Crown Commercial Service)
Always verify details on the official notice.
Last verified against Find a Tender Service (UK Cabinet Office / Crown Commercial Service) 1 month ago
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