Summary
Machine-generated summaryThis Spanish public tender, reference MY26/ITEAM/S/57, covers the supply of wafer dicing preparation equipment for the Pilot Line of the Universitat Politecnica de Valencia (project UPV47). The buyer is located in Spain. The procurement concerns integrated circuits and electronic microstructures, specifically equipment used to prepare wafers before cutting. No estimated contract value or submission deadline is stated in the source information. The tender is a public procurement procedure open to suppliers able to deliver this specialised semiconductor equipment; interested companies should consult the full tender documents for conditions, specifications and dates.
Description
Official source
Source: TED - Tenders Electronic Daily (Publications Office of the EU)
Always verify details on the official notice.
Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 1 month ago
Similar tenders
2
days left
POTP-2026-369 Supply of various materials for the prevention of damage caused by wolves in Catalonia
€59,857
est. value
Market context
- Avg. open tender · Electrical machinery
- €56,301,698
- Buyer track record on Aperlena
- 1 notices tracked · 0 awarded
Never miss a tender like this
516 new notices in Electrical machinery in Spain in the last 7 days. Get an email when new ones appear. Free.
Set up my alert