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Deutschland - Softwarepaket und Informationssysteme - Softwarepaket für den Entwurf von Höchstfrequenz- und Mikrowellenschaltungen

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Description

Softwarepaket für den Entwurf von Höchstfrequenz- und Mikrowellenschaltungen The software is an integrated design and verification platform for RF, microwave, RFIC, and advanced packaging applications. It combines circuit-level simulation, 3D electromagnetic (EM) simulation, RFIC design, and system-level verification within a single environment, covering the design flow from transistor-level circuit implementation through communication-system-level validation. The platform supports co-simulation between circuit and EM domains and includes interfaces for RFIC design flows (e.g. integration with third-party IC design tools). It is intended for the development of RF/microwave circuits, RFICs, mmWave designs, advanced packages, and high-frequency modules. The software is an integrated design and verification platform for RF, microwave, RFIC, and advanced packaging applications. It combines circuit-level simulation, 3D electromagnetic (EM) simulation, RFIC design, and system-level verification within a single environment, covering the design flow from transistor-level circuit implementation through communication-system-level validation. The platform supports co-simulation between circuit and EM domains and includes interfaces for RFIC design flows (e.g. integration with third-party IC design tools). It is intended for the development of RF/microwave circuits, RFICs, mmWave designs, advanced packages, and high-frequency modules.

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Source: TED - Tenders Electronic Daily (Publications Office of the EU)

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Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 1 month ago

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Avg. open tender · Software & IT systems
€54,121,483
2,819 open across Europe right now
Buyer track record on Aperlena
3 notices tracked · 2 awarded

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