Supply of wafer dicing preparation equipment for the UPV Pilot Line (UPV47)

The Universitat Politècnica de València, through its Rectorate, is procuring equipment for wafer cutting preparation for its Pilot Line (UPV47). The contract, identified by reference MY26/ITEAM/S/57, has an estimated value of 95000 EUR. The tender is published (status PUB). The buyer is a Spanish university in Valencia. Small businesses with suitable technical equipment for semiconductor wafer preparation may follow the official publication for participation rules.

Description

6 open tenders right now

• Supply, installation and commissioning of a complete evolved gas analysis (EGA) solution by coupling an existing thermogravimetric analyser with a gas chromatography system coupled to mass spectrometry (GCMS) 1 Oct 2026 · 7 days left
• Acquisition of an infrared spectroscopy platform (FTIR plus confocal microscope) 1 Oct 2026 · 7 days left
• Works to replace the exterior joinery of building 6C at the Vera campus of the Universitat Politecnica de Valencia 13 Oct 2026 · 19 days left

Recent awards

• Obra de reparación de la cubierta de nivel 3 en el edificio 8B del campus de Vera de la Universitat Politècnica de València

  awarded to SOGESER FACILITY SERVICES, S.L. €426,097

• Suministro e instalación de una fuente de rayos X para el microscopio ZEISS modelo Xradia620 Versa

  awarded to CARL ZEISS IBERIA SL €96,740

• Obra de reforma de climatización y ventilación en el bloque 5E de la Escuela Técnica Superior de Ingeniería Industrial del campus de Vera de la Universitat Politècnica de València

  awarded to FULTON S.A. €481,662

Market context

Avg. open tender · Electrical machinery

€52,179,522

3,118 open across Europe right now 100% below sector average

Buyer track record on Aperlena

112 notices tracked · 45 awarded

€10,651,061 in awarded contracts