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France - Machines et appareils microélectroniques - Acquisition d'un système d'assemblage de composants par la méthode flip-chip (flip-chip bonder)

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Description

Acquisition d'un système d'assemblage de composants par la méthode flip-chip (flip-chip bonder) pour les besoins de FEMTO-ST

Official source

Source: TED - Tenders Electronic Daily (Publications Office of the EU)

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Last verified against TED - Tenders Electronic Daily (Publications Office of the EU) 1 month ago

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Avg. open tender · Electrical machinery
€56,513,795
3,303 open across Europe right now
Buyer track record on Aperlena
10 notices tracked · 6 awarded
€2,024,282 in awarded contracts

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